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Kamyar Mehrabi Kochehbyoki

Education: 

  • M.Sc., Sep 2014 – Present
M.Sc. in École Polytechnique Fédérale de Lausanne, Switzerland
Major: Materials Science And Engineering
Minor: Biomedical Technologies 

  • B.Sc., Sep 2010 – Aug 2014
B.Sc. in Sharif University of Technology, Tehran, Iran
Major: Materials Science And Engineering 

Research Interests:

  • New Materials and Methods
  • Materials Characterization

Contact Me:

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Melt Spinning Laboratory (Oct. 2013)

 
  • Melt-Spinning

  • IMG_1464

  • Melt Spinning
  • ElectroDeposition Cell

Research Experiences:

 

  • Electrodeposition and characterization of Ag-Pd thin film on a silver substrate (B.Sc. thesis) 
Silver and palladium with atomic numbers of 47 and 46 respectively, have same crystalline structure of face-centered cubic, and lattice parameter and atomic diameter of them are close to each other. As a result of this similarity, they are isomorphous, fully soluble in alloying form. Silver-palladium plating has wide field of application, from electrical contacts to decorative application. High resistance to corrosion, High conductivity and resistance to hydrogen embrittlement are among its fascinating properties. In the following figure, the Sodium sulfide resistivity of the Ag-Pd electrodeposite versus Silver substrate is shown.

beforeBefore emerging to Na2S

afterAfter emerging to Na2S 

  • Fabrication and characterization of Nano Al2O3 SAC solder with rapid solidification process

  The development of lead-free solders has become important for material researchers due to health and environmental concerns regarding the high toxicity of lead. The European community, US Environmental Protection Agency (EPA), and electronics industries have started initiatives to reduce lead usage. Many lead-free solders have been studied as replacements for Sn–Pb solders. Sn–Ag–Cu solder is one of the earliest commercially available lead-free solders and also the most attractive candidate for surface mount technologies, as it provides better mechanical properties than do eutectic Sn–Pb solders.   We are currently investigating the effects of Al2O3 Nano particles on the Sn3.5Ag0.5Cu composite solder alloy and focusing on both microstructural development and thermomechanical properties.   The first aim of this study is to reduce the size of Ag3Sn precipitates by surface adsorption of surface Active Nano Al2O3, and the second aim is to fabricate rapidly solidified solder alloy by melt spinning technic.

Melt Spinning Machine

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Research Experiences: